A NUMERICAL SIMULATION TO TRANSIENT WAVE INDUCED HARBOR OSCILLATIONS USING BOUNDARY ELEMENT TECHNIQUE
نویسندگان
چکیده
منابع مشابه
Numerical Simulation of Shock-Wave/Boundary/Layer Interactions in a Hypersonic Compression Corner Flow
Numerical results are presented for the shock-boundary layer interactions in a hypersonic flow over a sharp leading edge compression corner. In this study, a second- order Godunov type scheme based on solving a Generalized Riemann Problem (GRP) at each cell interface is used to solve thin shear layer approximation of laminar Navier-Stokes (N-S) equations. The calculated flow-field shows general...
متن کاملThermal Boundary Resistance Measurements Using a Transient Thermoreflectance Technique
A transient thermoreflectance technique, using a 200-fs laser pulse, is demonstrated as a nondestructive method for measuring the thermal boundary resistance between a thin metallic film and dielectric substrate. Experimental results are presented for Au deposited on silicon and silicon dioxide substrates taken at room temperature and compared to a thermal model. The relevant thermal properties...
متن کاملNumerical simulation of prominence oscillations
We present numerical simulations, obtained with the Versatile Advection Code, of the oscillations of an inverse polarity prominence. The internal prominence equilibrium, the surrounding corona and the inert photosphere are well represented. Gravity and thermodynamics are not taken into account, but it is argued that these are not crucial. The oscillations can be understood in terms of a solid b...
متن کاملDiffusing-wave spectroscopy for arbitrary geometries: numerical analysis by a boundary-element method.
We present a boundary-element-method numerical procedure that can be used to solve for the diffusion equation of the field autocorrelation function in any arbitrary geometry with various boundary and source properties. We use this numerical method to study finite-sized effects in a circular slab and the influence of the angle in a cone-plate geometry. The latter is also compared with exact anal...
متن کاملBoundary Element Simulation of Electromigration
A primary cause of failure in microelectronic devices is void growth and movement in aluminum wire interconnects. In addition to thermal and mechanical stress, void evolution is driven by the electric field in the wire. Two new boundary element techniques, approximate Green's functions and Galerkin surface derivative evaluation, have been developed to assist in modeling the electromigration pro...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
ژورنال
عنوان ژورنال: Coastal Engineering Proceedings
سال: 1986
ISSN: 2156-1028,0589-087X
DOI: 10.9753/icce.v20.10